• Development
    •
  • Probe Test
    •  Final Test
  • Backend
    •
  • Quality
    •

    Final Test

    루트세미콘은 다양한 Package type의 Test Service를 제공하고 있으며 다양한 고객제품의 특성에 맞춰 Test Program 개발 및 Interface Board 제작등을 지원하고 있습니다.

    Final Test 공정 소개
    Visual inspection

    Scratch

    Contamination

    Electrical test
    Funtion Test
    Moisture Removal
    Final Visual Inspection

    Top, Bottom, Pocket

    2D,3D & PVI

    Post Seal

    Vacuum seal packing
    Tape&Reel Packing
    Test 장비 구축 현황
    Spandnix(SX-5000)

    - SVI 16ch +64V/-32V/128mA

    - MVI 8ch+64V/-32V/320mA

    - HVI 8ch+64V/-32V/320mA, 2ch ±64V/ ±2A

    - 표준 : HEAD256pin(Dig128pin+APU128pin)

    - 최대 : HEAD592pin(Dig256pin+APU336pin

    STI(AT-468)

    - 3D Inspection(Top, Bottom, Inpocket, Post Seal)

    - Test Site 8ea

    - Test 가능 Size 2X2~12X12

    - Input : Bulk

    - Output : Tape and Reel

    - UPH: 30K

    K&C(KC-8088)

    - Test Site: ~8 Parallel

    - Test 가능 Size 3X3~50X50

    - COK compatible with Epson

    - Index time: 0.43 sec

    - Tray input Tray out

    - UPH: 14K

    STI(Hexa-Maxx)

    - 3D Inspection(Top, Bottom, Inpocket, Post Seal)

    - Input : Tray

    - Output : Tape and Reel, Tray

    - UPH: 14K